iPhone Duo Features Hidden Heat Pipe in Hinge

Apple has designed a specific cooling system for the iPhone Duo to ensure the high performance of its A20 Pro chip. This system features a flexible graphite heat pipe, which is discreetly integrated within the device's hinge. The primary function of this heat pipe is to efficiently and uniformly transfer heat between the two distinct halves of the iPhone Duo's body. Even heat distribution helps to prevent localized overheating, thereby maintaining stable and optimal performance for the processor. This design reflects Apple's efforts to address thermal management challenges in foldable devices, especially when they are required to handle demanding tasks that necessitate high performance. The hidden heat pipe in the hinge represents an engineering solution aimed at optimizing user experience, ensuring the device operates smoothly and durably.

Key points
* The iPhone Duo uses a flexible graphite heat pipe.
* This pipe runs through the hinge to transfer heat between the two halves.
* Its purpose is to maintain high performance for the A20 Pro chip.

Nguồn / Source: VnExpress - Số hóa